Billy Ables / Age, Phone, Address

7867874, Jan 11, 2011

May 19, 2009

12/468520

Billy D. Ables - Richardson TX, US
John C. Ehmke - Dallas TX, US
Roland W. Gooch - Dallas TX, US

Raytheon Company - Waltham MA

H01L 21/46
H01L 21/30

438456, 257E21499, 257E21577, 438106, 438667, 438672

A hermetically sealed package includes a lid () hermetically bonded to a wafer or substrate (), with a chamber therebetween defined by a recess () in the lid. A circuit device () such as MEMS device is provided within the chamber on the substrate. A plurality of vias (-) are provided through the substrate, and each have a structure which facilitates a hermetic seal of a suitable level between opposite sides of the substrate. The vias provide electrical communication from externally of the assembly to the device disposed in the chamber.

2011011, May 19, 2011

Nov 17, 2009

12/620562

Alberto F. Viscarra - Torrance CA, US
David T. Winslow - Culver City CA, US
Billy D. Ables - Richardson TX, US
Kurt S. Ketola - Los Angeles CA, US
Kurt J. Krause - Redondo Beach CA, US
Kevin C. Rolston - Playa Del Rey CA, US
Rohn Sauer - Encino CA, US
James R. Chow - San Gabriel CA, US

H01P 11/00
H05K 3/06

29600, 29847

A process for fabricating a three dimensional molded feed structure is provided. In one embodiment, the invention relates to a process for fabricating a three dimensional radio frequency (RF) antenna structure, the process including providing a flexible circuit substrate, forming a first preselected pattern of channels in the flexible circuit substrate, depositing a conductive layer on the formed flexible substrate, and removing portions of the conductive layer to form a plurality of conductive traces.

2008009, May 1, 2008

Oct 31, 2006

11/555090

Premjeet Chahal - Plano TX, US
Billy D. Ables - Richardson TX, US
Francis J. Morris - Dallas TX, US

Raytheon Company - Waltham MA

B23K 35/12

228245

According to one embodiment of the invention, a method for sealing one or more vias comprises providing a first substrate having vias, forming an adhesion layer on an inner surface of the vias, sandwiching a solder layer between the first substrate and a second substrate, and elevating of the first substrate, second substrate, and solder layer to a temperature above a eutectic point and below a melting point of the solder layer. The act of elevating the solder layer to a temperature above the eutectic point and below the melting point causes the solder layer to flow into the vias in a generally consistent manner.

6633079, Oct 14, 2003

Sep 10, 2002

10/241062

James L. Cheever - Richardson TX
Charles L. Goldsmith - Plano TX
John C. Ehmke - Garland TX
Billy D. Ables - Richardson TX

Raytheon Company - Lexington MA

H01L 2314

257723, 257777

RF MicroElectroMechanical Systems (MEMS) circuitry ( ) on a first high resistivity substrate ( ) is combined with circuitry ( ) on a second low resistivity substrate ( ) by overlapping the first high resistivity substrate ( ) and MEMS circuitry ( ) with the low resistivity substrate ( ) and circuitry ( ) with the MEMS circuitry ( ) facing the second circuitry ( ). A dielectric lid ( ) is placed over the MEMS circuitry ( ) and between the first substrate ( ) and second substrate ( ) with an inert gas in a gap ( ) over the MEMS circuitry ( ). Interconnecting conductors ( ) extend perpendicular and through the high resistivity substrate ( ) and through the dielectric lid ( ) to make electrical connection with the low resistivity substrate ( ).